关于芯碁

Overview

Circuit Fabology Microelectronics Equipment Co., Ltd.

The company was established in June 2015, with the stock code: 688630.SH and a registered capital of 131.3 million yuan. It is located in the Integrated Circuit Industry Base of Hefei High-tech Zone, Anhui Province, China. The company specializes in the research and development and production of direct imaging equipment and direct writing lithography equipment with micro-nano direct writing lithography as the core technology.

The company insists on independent research and development and innovation, and has complete independent intellectual property rights. With the leading R&D level of the team, the company currently has more than 200 intellectual property rights. 

The company has built an intelligent R&D and manufacturing base of over 70,000 square meters that integrates R&D, production, and office. We will continue to adhere to strategic innovation, technological innovation, mechanism innovation, and talent innovation, and use innovation and technology to create more social value and commercial value.

Circuit Fabology Microelectronics Equipment Co., Ltd.
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Company Culture
Company Culture

Mission

Litho is changing the world.

Vision

IC Equipment, World Brand

Core Value

Customer-centric, Honest, Open and Introspective

Spirit

Innovative spirit, craftsman spirit, striving spirit, cooperative spirit

Brand

Brand

Brand
Brand
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Lead industry standard drafting and re-evaluation

As the first drafting unit of the group standard and the only human resources outsourcing service organization in the industry, it led the standard re-evaluation of the Shanghai Certification Association's "Human Resources Outsourcing Service Certification Requirements T/SCA120001-2018", which was officially released in July 2021 to promote the establishment of advanced service models and service standards in the industry.

Development Process

2024

The second phase of the park was capped

2023

Entered the FPD mass production lithography market

Shipments reached more than 1,000 units

2022

Entering the middle-end head customer

2021

Listed on SSE STAR Market on April 1

2019-2020

CFMEE Park was put into use

2018

Entered the PCB Solder Mask market

2017

Entered the IC substrate lithography market

Entered the AMOLED lithography market

The first equipment was exported to Chinese Taiwan

2015-2016

Micro-nano direct writing lithography innovation

Entering the semiconductor and PCB lithography markets

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professional deep ploughing

Digital drive

2024

2024

The second phase of the park was capped

2023

2023

Entered the FPD mass production lithography market

Shipments reached more than 1,000 units

2022

2022

Entering the middle-end head customer

2021

2021

Listed on SSE STAR Market on April 1

2019-2020

2019-2020

CFMEE Park was put into use

2018

2018

Entered the PCB Solder Mask market

2017

2017

Entered the IC substrate lithography market

Entered the AMOLED lithography market

The first equipment was exported to Chinese Taiwan

2015-2016

2015-2016

Micro-nano direct writing lithography innovation

Entering the semiconductor and PCB lithography markets

July 2023

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