PCB & IC Substrate
As printed circuit board density increases and design complexity continues to increase, CFMEE's direct imaging systems enable customers to produce advanced PCBs and IC substrates. CFMEE's direct imaging systems create high-quality and efficient imaging processes, driving continuous innovation in PCBs and IC substrates.
Pattern
Products cover most circuit processes such as ICS, SLP, HDI, FPC, HLC, MLB, etc.
Solder Mask
Products cover most circuit processes such as ICS, SLP, HDI, FPC, HLC, MLB, etc.
Drilling
For precision processing of HDI and FPC applications.
Automation
Products cover most circuit processes such as ICS, SLP, HDI, FPC, HLC, MLB, etc.
