MLF Direct Writing Lithography System Series
Adopting advanced digital lithography technology, without mask, can directly transfer image to the substrate coated with photosensitive material. The system can apply for the third-generation semiconductor silicon carbide process applications, such as, IGBT, ceramic package and other applications. MLF series have the compact structure, large depth of focus, high throughput, and process adaptability to dry film and photoresist, is an economical and flexible mass production solution.
Product Features
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High throughput direct writing lithography system
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Applied for the pattern and tracebility of power modules, advanced packaging and ceramic substrates
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Minimum lines & spaces:
6μm
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Maximum panel size:
12" x12"
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Auto alignment, back side alignment, user defined alignment mark
*The above data is derived from the test results of CFMEE laboratory, and the specific situation may vary depending on the actual use environment. The company reserves the right to adjust the relevant data and content without prior notice.
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