产品领域

NEX 30 Series

ICS

SLP

High-performance solder mask DI solutions, which adopt a high-power light source. These solutions are combined with high-power imaging and high-precision positioning system, suitable for various colors of solder mask inks. The system provides high yield, high accuracy, small SRO, and small side wall performance for IC Substrate and SLP applications.
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Product Features

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The benchmark for solder mask DI

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Applied in IC substrate and SLP solder mask process

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Minimal 30μm DAM and 50μm SRO

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Auto focus up to ±200μm

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Dual-table platform achieves alignment accuracy down to ±7μm with high productivity

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Throughput up to 120 panels/hour (one line, dual table)

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*The above data is derived from the test results of CFMEE laboratory, and the specific situation may vary depending on the actual use environment. The company reserves the right to adjust the relevant data and content without prior notice.

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Contact Us

If you need consultation and cooperation, please contact our sales and technical support team.
We will wholeheartedly provide you with professional answers and customized service solutions.

Service Hotline: +86-400-8935-098

Service Consultation: sales@cfmee.cn

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