WB 8 Wafer to Wafer Bonder
WB 8 Wafer to Wafer Bonder handles wafers up to 8 inch with semi-automated operation for the simeconductor industry like middle-end, MEMS and other fields. Based on CFMEE's continuous technological innovations, symmetric rapid heating&cooling system and the high-force system ensure the success of all kinds of bondings (e.g. Anodic, thermo compression).
Product Features
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The force up to 100kN in the temperature range up to 550°C
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Fully automated
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Excellent temperature and force uniformity
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High vacuum bonding chamber
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Rapid vacuum-pumping, heating and cooling processes
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Conprehensive multi-user management software, including user permissions, system languages, menu and process control, etc.
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All systems are oil-free
*The above data is derived from the test results of CFMEE laboratory, and the specific situation may vary depending on the actual use environment. The company reserves the right to adjust the relevant data and content without prior notice.
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