WA 8 Wafer to Wafer Aligner
WA 8 Wafer to Wafer Aligner is a state of the art tool to precisely align 2 wafers together and maintain alignment accuracy until bonding, featuring high precision, flexibility, ease of use and modular upgrade capability, and working from size 4, 6 and 8 inch wafers. This equipment can be used in middle-end, MEMS and other fields that require alignment of submicron range and high repeatability.
Product Features
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Within the submicron range
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Material can be transparent or non-transparent
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Alignment platform with axis of submicron range
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A specially designed WEC (Wedge Error Compensation)
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Fast switch of different sized wafers
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Maintenance-free independent AVT (Optional)
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Conprehensive multi-user management, including user permissions, system languages, menu and process control, etc.
*The above data is derived from the test results of CFMEE laboratory, and the specific situation may vary depending on the actual use environment. The company reserves the right to adjust the relevant data and content without prior notice.
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