PLP 3000 Panel Level Package Direct Writing Lithography System
Utilizing advanced digital lithography technology. It transfers an image directly, without mask, on the substrates coated with photosensitive material. The system is primarily uses for the application of the middle-end. It supports copper-clad laminates, composite materials, and glass substrates.
Product Features
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Equipped with Die shifts smart compensation，RDL intelligent pattern distribution, real-time auto focus and other designs to overcome warped page
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Support CFMEE one-stop solution which includes metrology, exposure, and inspection
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Panel size:
600 x 600mm
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Minimum lines & spaces:
3μm
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Overlay accuracy:
±2μm
*The above data is derived from the test results of CFMEE laboratory, and the specific situation may vary depending on the actual use environment. The company reserves the right to adjust the relevant data and content without prior notice.
Contact Us
We will wholeheartedly provide you with professional answers and customized service solutions.
Service Hotline: +86-400-8935-098
Service Consultation: sales@cfmee.cn