产品领域

WLP 2000 Wafer Level Package Direct Writing Lithography System

WLP 2000 direct writing lithography system adopts advanced digital lithography technology, without mask, can directly transfer an image to the substrate coated
with photosensitive material, mainly uses for 8inch/12inch middle-end applications. The system includes multi-optical engines for parallel scanning technology, with automatic alignment, back alignment, intelligent shift correction, WEE/WEP functions, and has obvious advantages in RDL, Bumping, TSV and System on Wafer（SoW） , and other processes.
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Product Features

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Equipped with Die shifts smart compensation，RDL intelligent pattern distribution, real-time auto focus、edge exposure WEE/WEP， backside alignment function

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Support CFMEE one-stop solution which includes metrology, exposure, and inspection

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Support wafer size:

12"与8"

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Minimum lines & spaces:

2μm

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Overlay accuracy:

±0.6μm

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*The above data is derived from the test results of CFMEE laboratory, and the specific situation may vary depending on the actual use environment. The company reserves the right to adjust the relevant data and content without prior notice.

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Contact Us

If you need consultation and cooperation, please contact our sales and technical support team.
We will wholeheartedly provide you with professional answers and customized service solutions.

Service Hotline: +86-400-8935-098

Service Consultation: sales@cfmee.cn

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