IC Equipment
With the continuous deepening of the application of CFMEE direct-write lithography technology, CFMEE products can be used in middle-end, micro-nano devices, power devices, flat panel display lithography and other applications, helping customers reduce costs, shorten production cycles and optimize processes.
Middle-end
Bonding
MEMS
Power Device
IC Substrate
Lead-Frame
Flat Panel
WLP 2000 direct writing lithography system adopts advanced digital lithography technology, without mask, can directly transfer an image to the substrate coated
with photosensitive material, mainly uses for 8inch/12inch middle-end applications. The system includes multi-optical engines for parallel scanning technology, with automatic alignment, back alignment, intelligent shift correction, WEE/WEP functions, and has obvious advantages in RDL, Bumping, TSV and System on Wafer（SoW） , and other processes.
Utilizing advanced digital lithography technology. It transfers an image directly, without mask, on the substrates coated with photosensitive material. The system is primarily uses for the application of the middle-end. It supports copper-clad laminates, composite materials, and glass substrates.
WB 8 Wafer to Wafer Bonder handles wafers up to 8 inch with semi-automated operation for the simeconductor industry like middle-end, MEMS and other fields. Based on CFMEE's continuous technological innovations, symmetric rapid heating&cooling system and the high-force system ensure the success of all kinds of bondings (e.g. Anodic, thermo compression).
WA 8 Wafer to Wafer Aligner is a state of the art tool to precisely align 2 wafers together and maintain alignment accuracy until bonding, featuring high precision, flexibility, ease of use and modular upgrade capability, and working from size 4, 6 and 8 inch wafers. This equipment can be used in middle-end, MEMS and other fields that require alignment of submicron range and high repeatability.
The system is based on the advanced DLP digital lithography technology, adopts high-precision precision motion platform, optical system, microenvironment control system, and has real-time auto focusing, automatic centering and other functions.
This device utilizes advanced digital lithography technology, allowing it to directly, without mask, transfer designed pattern on the substrates with photosensitive material. The system is flexible, compact, and cost-effective, specifically designed for universities, laboratories, and research institutions. Its main applications include the fabrication of various MEMS devices (such as MEMS microphones, pressure sensors, accelerometers, gyroscopes, ultrasonic sensors, piezoelectric sensors, etc.), as well as photomask making.
Adopting advanced digital lithography technology, without mask, can directly transfer image to the substrate coated with photosensitive material. The system can apply for the third-generation semiconductor silicon carbide process applications, such as, IGBT, ceramic package and other applications. MLF series have the compact structure, large depth of focus, high throughput, and process adaptability to dry film and photoresist, is an economical and flexible mass production solution.
Suitable for various colors of solder mask inks. The system provides high yield, high accuracy, small SRO, and small side wall performance for IC Substrate and SLP applications.
Industry-leading direct imaging solutions for IC substrates, such as FC-BGA, FC-CSP, etc., and can adapt with the industry's most common dry films to achieve high throughput. The system adopts DMD technology to achieve excellent line width uniformity and edge roughness of fine lines through high-resolution data analysis. The system can ensure high quality while reducing overall operating costs.
Using DMD technology, the system can achieve a minimum of 25μm fine line and excellent line width uniformity and edge roughness through high-precision data resolution, which can reduce the overall cost while ensuring the high quality.
