Power Device
Middle-end
Bonding
MEMS
Power Device
IC Substrate
Lead-Frame
Flat Panel
Adopting advanced digital lithography technology, without mask, can directly transfer image to the substrate coated with photosensitive material. The system can apply for the third-generation semiconductor silicon carbide process applications, such as, IGBT, ceramic package and other applications. MLF series have the compact structure, large depth of focus, high throughput, and process adaptability to dry film and photoresist, is an economical and flexible mass production solution.
