MAS Pattern DI Series
Industry-leading direct imaging solutions for IC substrates, such as FC-BGA, FC-CSP, etc., and can adapt with the industry's most common dry films to achieve high throughput. The system adopts DMD technology to achieve excellent line width uniformity and edge roughness of fine lines through high-resolution data analysis. The system can ensure high quality while reducing overall operating costs.
Product Features
01
Applied in mass production of IC substrates (FC-CSP, FC-BGA) and SLP
01
Minimal Line/Space:
4μm
*The above data is derived from the test results of CFMEE laboratory, and the specific situation may vary depending on the actual use environment. The company reserves the right to adjust the relevant data and content without prior notice.
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