NEX Solder Mask DI Series
High-performance solder mask DI solutions, which adopt a high-power light source. These solutions are combined with high-power imaging and high-precision positioning system, suitable for various colors of solder mask inks. The system provides high yield, high accuracy, small SRO, and small side wall performance for IC Substrate and SLP applications.
Product Features
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Applied in IC substrate and SLP solder mask process
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Minimal 30μm DAM and 50μm SRO
*The above data is derived from the test results of CFMEE laboratory, and the specific situation may vary depending on the actual use environment. The company reserves the right to adjust the relevant data and content without prior notice.
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