Middle-end
Middle-end
Bonding
MEMS
Power Device
IC Substrate
Lead-Frame
Flat Panel
WLP 2000 direct writing lithography system adopts advanced digital lithography technology, without mask, can directly transfer an image to the substrate coated
with photosensitive material, mainly uses for 8inch/12inch middle-end applications. The system includes multi-optical engines for parallel scanning technology, with automatic alignment, back alignment, intelligent shift correction, WEE/WEP functions, and has obvious advantages in RDL, Bumping, TSV and System on Wafer（SoW） , and other processes.
Utilizing advanced digital lithography technology. It transfers an image directly, without mask, on the substrates coated with photosensitive material. The system is primarily uses for the application of the middle-end. It supports copper-clad laminates, composite materials, and glass substrates.
