Bonding
Middle-end
Bonding
MEMS
Power Device
IC Substrate
Lead-Frame
Flat Panel
WB 8 Wafer to Wafer Bonder handles wafers up to 8 inch with semi-automated operation for the simeconductor industry like middle-end, MEMS and other fields. Based on CFMEE's continuous technological innovations, symmetric rapid heating&cooling system and the high-force system ensure the success of all kinds of bondings (e.g. Anodic, thermo compression).
WA 8 Wafer to Wafer Aligner is a state of the art tool to precisely align 2 wafers together and maintain alignment accuracy until bonding, featuring high precision, flexibility, ease of use and modular upgrade capability, and working from size 4, 6 and 8 inch wafers. This equipment can be used in middle-end, MEMS and other fields that require alignment of submicron range and high repeatability.
