MEMS
Middle-end
Bonding
MEMS
Power Device
IC Substrate
Lead-Frame
Flat Panel
The system is based on the advanced DLP digital lithography technology, adopts high-precision precision motion platform, optical system, microenvironment control system, and has real-time auto focusing, automatic centering and other functions.
This device utilizes advanced digital lithography technology, allowing it to directly, without mask, transfer designed pattern on the substrates with photosensitive material. The system is flexible, compact, and cost-effective, specifically designed for universities, laboratories, and research institutions. Its main applications include the fabrication of various MEMS devices (such as MEMS microphones, pressure sensors, accelerometers, gyroscopes, ultrasonic sensors, piezoelectric sensors, etc.), as well as photomask making.
