IC Substrate
Middle-end
Bonding
MEMS
Power Device
IC Substrate
Lead-Frame
Flat Panel
Suitable for various colors of solder mask inks. The system provides high yield, high accuracy, small SRO, and small side wall performance for IC Substrate and SLP applications.
Industry-leading direct imaging solutions for IC substrates, such as FC-BGA, FC-CSP, etc., and can adapt with the industry's most common dry films to achieve high throughput. The system adopts DMD technology to achieve excellent line width uniformity and edge roughness of fine lines through high-resolution data analysis. The system can ensure high quality while reducing overall operating costs.
